Emile Noothout
Affiliations:- Delft University of Technology, Netherlands
According to our database1,
Emile Noothout
authored at least 22 papers
between 2015 and 2024.
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Bibliography
2024
A 125 μ m-Pitch-Matched Transceiver ASIC With Micro-Beamforming ADC and Multi-Level Signaling for 3-D Transfontanelle Ultrasonography.
IEEE J. Solid State Circuits, August, 2024
A Pitch-Matched High-Frame-Rate Ultrasound Imaging ASIC for Catheter-Based 3-D Probes.
IEEE J. Solid State Circuits, February, 2024
A 2000-Volumes/s 3D Ultrasound Imaging Chip with Monolithically-Integrated 11.7×23.4mm<sup>2</sup> 2048-Element CMUT Array and Arbitrary-Wave TX Beamformer.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
2023
A 1.2-mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3-D Ultrasound Imaging.
IEEE J. Solid State Circuits, September, 2023
A Pitch-Matched Low-Noise Analog Front-End With Accurate Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.
IEEE J. Solid State Circuits, 2023
A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
2022
Sensors, 2022
A Pitch-Matched Transceiver ASIC With Shared Hybrid Beamforming ADC for High-Frame-Rate 3-D Intracardiac Echocardiography.
IEEE J. Solid State Circuits, 2022
A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
A 1.2mW/channel 100µm-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
2021
Design of an Ultrasound Transceiver ASIC with a Switching-Artifact Reduction Technique for 3D Carotid Artery Imaging.
Sensors, 2021
IEEE J. Solid State Circuits, 2021
A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays.
Proceedings of the 51st IEEE European Solid-State Device Research Conference, 2021
2019
A 1.54mW/Element 150μm-Pitch-Matched Receiver ASIC with Element-Level SAR/Shared-Single-Slope Hybrid ADCs for Miniature 3D Ultrasound Probes.
Proceedings of the 2019 Symposium on VLSI Circuits, Kyoto, Japan, June 9-14, 2019, 2019
2018
A Front-End ASIC With High-Voltage Transmit Switching and Receive Digitization for 3-D Forward-Looking Intravascular Ultrasound Imaging.
IEEE J. Solid State Circuits, 2018
A Reconfigurable Ultrasound Transceiver ASIC With 24×40 Elements for 3-D Carotid Artery Imaging.
IEEE J. Solid State Circuits, 2018
A Pitch-Matched Front-End ASIC With Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes.
IEEE J. Solid State Circuits, 2018
A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018
2017
A Front-End ASIC With Receive Sub-array Beamforming Integrated With a 32 × 32 PZT Matrix Transducer for 3-D Transesophageal Echocardiography.
IEEE J. Solid State Circuits, 2017
A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes.
Proceedings of the 43rd IEEE European Solid State Circuits Conference, 2017
A front-end ASIC with high-voltage transmit switching and receive digitization for forward-looking intravascular ultrasound.
Proceedings of the 2017 IEEE Custom Integrated Circuits Conference, 2017
2015
Proceedings of the 6th International Workshop on Advances in Sensors and Interfaces, 2015