Eero Ristolainen

According to our database, Eero Ristolainen authored at least 12 papers between 2001 and 2006.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2006

Balancing temperature dependence of on-wafer SOS inductors.

Päivi H. Karjalainen, Eero Ristolainen

Microelectron. Reliab., 2006

2005

Flip chip attachment on flexible LCP substrate using an ACF.

Laura Frisk, Eero Ristolainen

Microelectron. Reliab., 2005

2004

Study of adhesive flip chip bonding process and failure mechanisms of ACA joints.

Anne Seppälä, Eero Ristolainen

Microelectron. Reliab., 2004

The effect of solder paste composition on the reliability of SnAgCu joints.

S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö

Microelectron. Reliab., 2004

Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates.

Laura Frisk, Anne Seppälä, Eero Ristolainen

Microelectron. Reliab., 2004

2003

Strength of Ta-Si interfaces by molecular dynamics.

Pekka Heino, Eero Ristolainen

Microelectron. Reliab., 2003

Thermal conduction at the nanoscale in some metals by MD.

Pekka Heino, Eero Ristolainen

Microelectron. J., 2003

Evaluation Of Resonating Channel Transistor In SOI Wafer.

S. Myllymaki, Eero Ristolainen, Pekka Heino, A. Lehto, K. Varjonen

Int. J. Comput. Eng. Sci., 2003

2002

Failure mechanisms of adhesive flip chip joints.

Anne Seppälä, T. Allinniemi, Eero Ristolainen

Microelectron. Reliab., 2002

Anisotropic conductive film flip chip joining using thin chips.

Erja Jokinen, Eero Ristolainen

Microelectron. Reliab., 2002

Impact of component placement in solder joint reliability.

T. Alander, S. Nurmi, Pekka Heino, Eero Ristolainen

Microelectron. Reliab., 2002

2001

Reliability of 80 mum pitch flip chip attachment on flex.

Petteri Palm, Jarmo Määttänen, Aulis Tuominen, Eero Ristolainen

Microelectron. Reliab., 2001