Ee-Hua Wong

According to our database, Ee-Hua Wong authored at least 14 papers between 2003 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2017

Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions.

Ee-Hua Wong, Johan Liu

Microelectron. Reliab., 2017

2016

Moisture diffusion modeling - A critical review.

Ee-Hua Wong, S. B. Park

Microelectron. Reliab., 2016

Creep fatigue models of solder joints: A critical review.

Ee-Hua Wong, W. D. van Driel, Abhijit Dasgupta, Michael G. Pecht

Microelectron. Reliab., 2016

Constitutive modeling of solder alloys for drop-impact applications.

Ee-Hua Wong, J. Chrisp, C. S. Selvanayagam, S. K. W. Seah

Microelectron. Reliab., 2016

2015

Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption.

Ee-Hua Wong, Jarrod Cook, M. Dreno, Dao-Long Chen, Yi-Shao Lai

Microelectron. Reliab., 2015

The fundamentals of thermal-mass diffusion analogy.

Ee-Hua Wong

Microelectron. Reliab., 2015

2009

Advances in the drop-impact reliability of solder joints for mobile applications.

Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai

Microelectron. Reliab., 2009

The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation.

Ee-Hua Wong, Yiu-Wing Mai

Microelectron. Reliab., 2009

2008

A review of board level solder joints for mobile applications.

Ee-Hua Wong, S. K. W. Seah, V. P. W. Shim

Microelectron. Reliab., 2008

Correlation studies for component level ball impact shear test and board level drop test.

Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh

Microelectron. Reliab., 2008

2006

New insights into board level drop impact.

Ee-Hua Wong, Yiu-Wing Mai

Microelectron. Reliab., 2006

2005

Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives.

Xiaowu Zhang, Ee-Hua Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao

Microelectron. Reliab., 2005

2004

Thermo-mechanical finite element analysis in a multichip build up substrate based package design.

Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath

Microelectron. Reliab., 2004

2003

Moisture absorption and diffusion characterisation of packaging materials--advanced treatment.

Ee-Hua Wong, Ranjan Rajoo

Microelectron. Reliab., 2003