Edward Cullen

According to our database, Edward Cullen authored at least 8 papers between 2014 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

A 1-V Bandgap Reference in 7-nm FinFET With a Programmable Temperature Coefficient and Inaccuracy of ±0.2% From -45°C to 125°C.

Umanath Kamath, Edward Cullen, Tao Yu, John Jennings, Susan Wu, Peng Lim, Brendan Farley, Robert Bogdan Staszewski

IEEE J. Solid State Circuits, 2019

2018

A 13Bit 5GS/S ADC with Time-Interleaved Chopping Calibration in 16NM FinFET.

Bruno Vaz, Bob Verbruggen, Christophe Erdmann, Diarmuid Collins, John McGrath, Ali Boumaalif, Edward Cullen, Darragh Walsh, Alonso Morgado, Conrado Mesadri, Brian Long, Rajitha Pathepuram, Ronnie De La Torre, Alvin Manlapat, Georgios Karyotis, Dimitris Tsaliagos, Patrick Lynch, Peng Lim, Daire Breathnach, Brendan Farley

Proceedings of the 2018 IEEE Symposium on VLSI Circuits, 2018

BJT Device and Circuit Co-Optimization Enabling Bandgap Reference and Temperature Sensing in 7-nm FinFET.

Umanath Kamath, Tao Yu, Wei Yao, Edward Cullen, John Jennings, Susan Wu, Peng Lim, Brendan Farley, Robert Bogdan Staszewski

Proceedings of the 48th European Solid-State Device Research Conference, 2018

A 1 V Bandgap Reference in 7-nm FinFET with a Programmable Temperature Coefficient and an Inaccuracy of ±0.2% from -45°C to 125°C.

Umanath Kamath, Edward Cullen, John Jennings, Ionut Cical, Darragh Walsh, Peng Lim, Brendan Farley, Robert Bogdan Staszewski

Proceedings of the 44th IEEE European Solid State Circuits Conference, 2018

2017

16.3 A 330mW 14b 6.8GS/s dual-mode RF DAC in 16nm FinFET achieving -70.8dBc ACPR in a 20MHz channel at 5.2GHz.

Christophe Erdmann, Edward Cullen, Damien Brouard, Roberto Pelliconi, Bob Verbruggen, John McGrath, Diarmuid Collins, Marites De La Torre, Pierrick Gay, Patrick Lynch, Peng Lim, Anthony Collins, Brendan Farley

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

A programmable RFSoC in 16nm FinFET technology for wideband communications.

Brendan Farley, Christophe Erdmann, Bruno Vaz, John McGrath, Edward Cullen, Bob Verbruggen, Roberto Pelliconi, Daire Breathnach, Peng Lim, Ali Boumaalif, Patrick Lynch, Conrado Mesadri, David Melinn, Kwee Peng Yap, Liam Madden

Proceedings of the IEEE Asian Solid-State Circuits Conference, 2017

2015

A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters.

Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden

IEEE J. Solid State Circuits, 2015

2014

6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters.

Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden

Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014