E. Sone

According to our database, E. Sone authored at least 2 papers between 2021 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding.

Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2023

2021

Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications.

Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima

Proceedings of the IEEE International 3D Systems Integration Conference, 2021