E. Rolland
According to our database1,
E. Rolland
authored at least 4 papers
between 1998 and 2022.
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Bibliography
2022
Proceedings of the International Conference on IC Design and Technology, 2022
2019
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2014
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO<sub>2</sub> direct hybrid bonding.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
1998