Douglas Winterberg
According to our database1,
Douglas Winterberg
authored at least 3 papers
between 2023 and 2024.
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Bibliography
2024
ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., January, 2024
ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning.
Proceedings of the 29th Asia and South Pacific Design Automation Conference, 2024
2023
One-Dimensional Deep Image Prior for Curve Fitting of S-Parameters from Electromagnetic Solvers.
Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023