Dongjin Kim
Orcid: 0000-0002-6814-6132Affiliations:
- Osaka University, Department of Adaptive Machine Systems, Suita, Japan
- Osaka University, Institute of Scientific and Industrial Research, Ibaraki, Japan
According to our database1,
Dongjin Kim
authored at least 2 papers
in 2018.
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Bibliography
2018
Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure.
Microelectron. Reliab., 2018
Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver.
Microelectron. Reliab., 2018