Dongil Kwon
According to our database1,
Dongil Kwon
authored at least 2 papers
between 2011 and 2017.
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Bibliography
2017
IEEE Trans. Ind. Electron., 2017
2011
Mechanical characterization of residual stress around TSV through instrumented indentation algorithm.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011