Dong-Uk Lee
According to our database1,
Dong-Uk Lee
authored at least 17 papers
between 2006 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2024
Measurement of Long-Term Tidal Flat Area Variation Using Multi-Temporal Sentinel-1 at Nakdong River Estuary Via Tidal and Seasonal Effect Mitigation.
Proceedings of the IGARSS 2024, 2024
2022
A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization.
Proceedings of the IEEE International Solid-State Circuits Conference, 2022
2021
Proceedings of the IEEE International Solid-State Circuits Conference, 2021
2020
A 1.1-V 10-nm Class 6.4-Gb/s/Pin 16-Gb DDR5 SDRAM With a Phase Rotator-ILO DLL, High-Speed SerDes, and DFE/FFE Equalization Scheme for Rx/Tx.
IEEE J. Solid State Circuits, 2020
22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarter Bank Structure, Power Dispersion and an Instruction-Based At-Speed PMBIST.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020
2019
A 1.1V 1ynm 6.4Gb/s/pin 16Gb DDR5 SDRAM with a Phase-Rotator-Based DLL, High-Speed SerDes and RX/TX Equalization Scheme.
Proceedings of the IEEE International Solid- State Circuits Conference, 2019
2018
A 1.2V 64Gb 341GB/S HBM2 stacked DRAM with spiral point-to-point TSV structure and improved bank group data control.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018
2015
A 1.2 V 8 Gb 8-Channel 128 GB/s High-Bandwidth Memory (HBM) Stacked DRAM With Effective I/O Test Circuits.
IEEE J. Solid State Circuits, 2015
Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015
2014
An exact measurement and repair circuit of TSV connections for 128GB/s high-bandwidth memory(HBM) stacked DRAM.
Proceedings of the Symposium on VLSI Circuits, 2014
25.2 A 1.2V 8Gb 8-channel 128GB/s high-bandwidth memory (HBM) stacked DRAM with effective microbump I/O test methods using 29nm process and TSV.
Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014
2009
Robust Frame Synchronization for Low Signal-to-Noise Ratio Channels Using Energy-Corrected Differential Correlation.
EURASIP J. Wirel. Commun. Netw., 2009
A 1.6V 3.3Gb/s GDDR3 DRAM with dual-mode phase- and delay-locked loop using power-noise management with unregulated power supply in 54nm CMOS.
Proceedings of the IEEE International Solid-State Circuits Conference, 2009
2008
Electrical Characterization of Nano-Floating Gated Silicon-on-Insulator Memory with In<sub>2</sub>O<sub>3</sub> Nano-Particles Embedded in Polyimide Insulator.
IEICE Trans. Electron., 2008
A 0.1-to-1.5GHz 4.2mW All-Digital DLL with Dual Duty-Cycle Correction Circuit and Update Gear Circuit for DRAM in 66nm CMOS Technology.
Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008
Multi-Slew-Rate Output Driver and Optimized Impedance-Calibration Circuit for 66nm 3.0Gb/s/pin DRAM Interface.
Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008
2006
A 2.5Gb/s/pin 256Mb GDDR3 SDRAM with Series Pipelined CAS Latency Control and Dual-Loop Digital DLL.
Proceedings of the 2006 IEEE International Solid State Circuits Conference, 2006