Dipak Sengupta

According to our database, Dipak Sengupta authored at least 3 papers between 2002 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2017

A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications.

Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O'Donnell, Dipak Sengupta, Seungbae Park

Sensors, 2017

2008

Failure analysis of contact probe pins for SnPb and Sn applications.

Changsoo Jang, Seungbae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta

Microelectron. Reliab., 2008

2002

A High Precision Shell Element with Shear Deformation for the Analysis of Isotropic and Composite Shells.

Abdul Hamid Sheikh, Salil Haldar, Dipak Sengupta

Int. J. Comput. Eng. Sci., 2002