Ding-Ming Kwai
Orcid: 0000-0001-7769-7879
According to our database1,
Ding-Ming Kwai
authored at least 83 papers
between 1989 and 2020.
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Bibliography
2020
Proceedings of the IEEE International Test Conference in Asia, 2020
2018
Proceedings of the 23rd Asia and South Pacific Design Automation Conference, 2018
2017
Proceedings of the International Test Conference in Asia, 2017
Proceedings of the 2017 IEEE Computer Society Annual Symposium on VLSI, 2017
Proceedings of the 2017 IEEE Computer Society Annual Symposium on VLSI, 2017
Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017
Proceedings of the 2017 IEEE International Conference on Computer Design, 2017
Heterogeneous chip power delivery modeling and co-synthesis for practical 3DIC realization.
Proceedings of the 22nd Asia and South Pacific Design Automation Conference, 2017
2016
Proceedings of the 2016 IEEE International Test Conference, 2016
Proceedings of the 25th IEEE Asian Test Symposium, 2016
2015
A computer designed half Gb 16-channel 819Gb/s high-bandwidth and 10ns low-latency DRAM for 3D stacked memory devices using TSVs.
Proceedings of the Symposium on VLSI Circuits, 2015
Proceedings of the VLSI Design, Automation and Test, 2015
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Application-Independent Testing of 3-D Field Programmable Gate Array Interconnect Faults.
IEEE Trans. Very Large Scale Integr. Syst., 2014
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014
A power delivery network (PDN) engineering change order (ECO) approach for repairing IR-drop failures after the routing stage.
Proceedings of the Technical Papers of 2014 International Symposium on VLSI Design, 2014
Proceedings of the 32nd IEEE International Conference on Computer Design, 2014
Proceedings of the 23rd IEEE Asian Test Symposium, 2014
Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs.
Proceedings of the 23rd IEEE Asian Test Symposium, 2014
2013
In-Situ Method for TSV Delay Testing and Characterization Using Input Sensitivity Analysis.
IEEE Trans. Very Large Scale Integr. Syst., 2013
IEEE Trans. Very Large Scale Integr. Syst., 2013
IEEE Trans. Circuits Syst. I Regul. Pap., 2013
Reactivation of Spares for Off-Chip Memory Repair After Die Stacking in a 3-D IC With TSVs.
IEEE Trans. Circuits Syst. I Regul. Pap., 2013
Parametric Delay Test of Post-Bond Through-Silicon Vias in 3-D ICs via Variable Output Thresholding Analysis.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013
Proceedings of the 31st IEEE VLSI Test Symposium, 2013
Proceedings of the 31st IEEE VLSI Test Symposium, 2013
Proceedings of the 2013 International Symposium on VLSI Design, Automation, and Test, 2013
Proceedings of the 2013 International Symposium on VLSI Design, Automation, and Test, 2013
A case study: 3-D stacked memory system architecture exploration by ESL virtual platform.
Proceedings of the 2013 International Symposium on VLSI Design, Automation, and Test, 2013
Proceedings of the 2013 International Symposium on VLSI Design, Automation, and Test, 2013
Benchmarking for research in power delivery networks of three-dimensional integrated circuits.
Proceedings of the International Symposium on Physical Design, 2013
Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013
2012
An MCT-Based Bit-Weight Extraction Technique for Embedded SAR ADC Testing and Calibration.
J. Electron. Test., 2012
Proceedings of the 30th IEEE VLSI Test Symposium, 2012
Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, 2012
Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, 2012
Proceedings of the 2012 IEEE International Test Conference, 2012
Proceedings of the 49th Annual Design Automation Conference 2012, 2012
Capturing the phantom of the power grid - on the runtime adaptive techniques for noise reduction.
Proceedings of the 17th Asia and South Pacific Design Automation Conference, 2012
2011
IEEE Trans. Very Large Scale Integr. Syst., 2011
Proceedings of the 29th IEEE VLSI Test Symposium, 2011
3D Stacked IC layout considering bond pad density and doubling for manufacturing yield improvement.
Proceedings of the 12th International Symposium on Quality Electronic Design, 2011
Proceedings of the International SoC Design Conference, 2011
A Pre- and Post-bond Self-Testing and Calibration Methodology for SAR ADC Array in 3-D CMOS Imager.
Proceedings of the 16th European Test Symposium, 2011
Thermal-aware on-line task allocation for 3D multi-core processor throughput optimization.
Proceedings of the Design, Automation and Test in Europe, 2011
A self-testing and calibration method for embedded successive approximation register ADC.
Proceedings of the 16th Asia South Pacific Design Automation Conference, 2011
2010
Proceedings of the 28th IEEE VLSI Test Symposium, 2010
Proceedings of the 47th Design Automation Conference, 2010
Proceedings of the 19th IEEE Asian Test Symposium, 2010
Proceedings of the 19th IEEE Asian Test Symposium, 2010
Proceedings of the 15th Asia South Pacific Design Automation Conference, 2010
Proceedings of the 15th Asia South Pacific Design Automation Conference, 2010
2009
Proceedings of the Eighteentgh Asian Test Symposium, 2009
2006
Proceedings of the 14th IEEE International Workshop on Memory Technology, 2006
FlexiVia ROM Compiler Programmable on Different Via Layers Based on Top Metal Assignment.
Proceedings of the 14th IEEE International Workshop on Memory Technology, 2006
2005
Proceedings of the 13th IEEE International Workshop on Memory Technology, 2005
Via-programmable read-only memory design for full code coverage using a dynamic bit-line shielding technique.
Proceedings of the 13th IEEE International Workshop on Memory Technology, 2005
2004
Comparing four classes of torus-based parallel architectures: Networkparameters and communication performance.
Math. Comput. Model., 2004
J. Parallel Distributed Comput., 2004
Supply and Substrate Noise Tolerance Using Dynamic Tracking Clusters in Configurable Memory Designs.
Proceedings of the 5th International Symposium on Quality of Electronic Design (ISQED 2004), 2004
2003
Practical considerations in applying Σ-Δ modulation-based analog BIST to sampled-data systems.
IEEE Trans. Circuits Syst. II Express Briefs, 2003
Parallel Architectures and Adaptation Algorithms for Programmable FIR Digital Filters With Fully Pipelined Data and Control Flows.
J. Inf. Sci. Eng., 2003
2001
Scalable Linear Array Architecture with Data-Driven Control for Ultrahigh-Speed Vector Quantization.
J. VLSI Signal Process., 2001
IEEE Trans. Parallel Distributed Syst., 2001
2000
Characterization and Generalization of Honeycomb and Diamond Networks.
Proceedings of the International Conference on Parallel and Distributed Processing Techniques and Applications, 2000
Proceedings of the 9th Asian Test Symposium (ATS 2000), 4-6 December 2000, Taipei, Taiwan, 2000
1999
IEEE Trans. Parallel Distributed Syst., 1999
Data-Driven Control Scheme for Linear Arrays: Application to a Stable Insertion Sorter.
IEEE Trans. Parallel Distributed Syst., 1999
1998
1997
Microprocess. Microsystems, 1997
A Class of Fixed-Degree Cayley-Graph Interconnection Networks Derived by Pruning k-ary n-cubes.
Proceedings of the 1997 International Conference on Parallel Processing (ICPP '97), 1997
1996
J. VLSI Signal Process., 1996
Parallel Process. Lett., 1996
Proceedings of the Eighth IEEE Symposium on Parallel and Distributed Processing, 1996
Comparing the Performance Parameters of Two Network Structures for Scalable Massively Parallel Processors.
Proceedings of the MASCOTS '96, 1996
1992
IEEE Trans. Computers, 1992
1989
Integr., 1989