Desmond Y. R. Chong

According to our database, Desmond Y. R. Chong authored at least 8 papers between 2006 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Proximal cementation of a collarless polished tapered hip stem: biomechanical analysis using a validated finite element model.

Carol Sze Yee Ling, Aiman Izmin, Mitsugu Todo, Azhar M. Merican, Desmond Y. R. Chong

Medical Biol. Eng. Comput., November, 2024

2023

Effects of bilateral sagittal split ramus osteotomy and bimaxillary osteotomies on stress distribution of temporomandibular joints in patients with maxillofacial deformity under asymmetric occlusions.

Haotian Luo, Haidong Teng, Desmond Y. R. Chong, Zhan Liu

Medical Biol. Eng. Comput., June, 2023

A deep dive into the static force transmission of the human masticatory system and its biomechanical effects on the temporomandibular joint.

Tinghui Sun, Desmond Y. R. Chong, Bingmei Shao, Zhan Liu

Comput. Methods Programs Biomed., March, 2023

2022

Descriptions of the dynamic joint space of the temporomandibular joint.

Jingheng Shu, Annan Li, Bingmei Shao, Desmond Y. R. Chong, Jie Yao, Zhan Liu

Comput. Methods Programs Biomed., 2022

Polka dot cementless talar component in enhancing total ankle replacement fixation: A parametric study using the finite element analysis approach.

Irwan Shah Mohd Moideen, Chin Tat Lim, Raye C. H. Yeow, Desmond Y. R. Chong

Comput. Biol. Medicine, 2022

2020

Finite element analysis of bone and implant stresses for customized 3D-printed orthopaedic implants in fracture fixation.

Lina Yan, Joel Louis Lim, Jun Wei Lee, Clement Shi Hao Tia, Gavin Kane O'Neill, Desmond Y. R. Chong

Medical Biol. Eng. Comput., 2020

2019

Biomechanical analysis of proximal tibia bone grafting and the effect of the size of osteotomy using a validated finite element model.

David Q. K. Ng, Chin Tat Lim, Amit K. Ramruttun, Ken Jin Tan, Wilson Wang, Desmond Y. R. Chong

Medical Biol. Eng. Comput., 2019

2006

Drop impact reliability testing for lead-free and lead-based soldered IC packages.

Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low

Microelectron. Reliab., 2006