Dayanand Nagalingam

According to our database, Dayanand Nagalingam authored at least 4 papers between 2017 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Failure analysis on 14 nm FinFET devices with ESD CDM failure.

Shaalini Chithambaram, Pik Kee Tan, Yuzhe Zhao, Binghai Liu, Yinzhe Ma, Alfred Quah, Dayanand Nagalingam, Yanlin Pan, Zhihong Mai

Microelectron. Reliab., 2018

2017

Static fault localization of subtle metallization defects using near infrared photon emission microscopy.

Alfred C. T. Quah, Dayanand Nagalingam, Seung Je Moon, Edy Susanto, Ghim Boon Ang, Soh Ping Neo, Jeffrey Lam, Zhihong Mai

Microelectron. Reliab., 2017

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect.

Soh Ping Neo, Alfred C. T. Quah, Ghim Boon Ang, Dayanand Nagalingam, Hnin Hnin Ma, Siong Luong Ting, C. W. Soo, Changqing Chen, Zhihong Mai, Jeffrey Lam

Microelectron. Reliab., 2017

Application of Scanning Capacitance Microscopy on SOI device with wafer edge low yield pattern.

Changqing Chen, Ghim Boon Ang, Peng Tiong Ng, Francis Rivai, Soh Ping Neo, Dayanand Nagalingam, Kim Hong Yip, Jeffery Lam, Zhihong Mai

Microelectron. Reliab., 2017