Dawei Wang

Orcid: 0000-0001-5612-6313

Affiliations:

Hangzhou Dianzi University, Hangzhou, China

According to our database¹, Dawei Wang authored at least 15 papers between 2018 and 2024.

Collaborative distances:

Dijkstra number² of four.
Erdős number³ of four.

Timeline

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PhD thesis

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Bibliography

2024

Implementation of Multiple-Step Quantized STDP Based on Novel Memristive Synapses.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., August, 2024

An Absorptive Common-Mode Suppression Filter Based on Resistor-Loaded M-Type Structure.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. II Express Briefs, July, 2024

Modeling and signal integrity analysis of silicon interposer channels based on MTL and KBNN.

[BibT_eX]

[DOI]

Microelectron. J., 2024

2022

Swarm Intelligence Algorithm-Based Optimal Design of Microwave Microfluidic Sensors.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., 2022

A Complementary Split-Ring Resonator (CSRR)-Based 2D Displacement Sensor.

[BibT_eX]

[DOI]

Symmetry, 2022

An Improved Split-Ring Resonator-Based Sensor for Microfluidic Applications.

[BibT_eX]

[DOI]

Sensors, 2022

Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration.

[BibT_eX]

[DOI]

Microelectron. J., 2022

2021

On the applicability of two-bit carbon nanotube through-silicon via for power distribution networks in 3-D integrated circuits.

[BibT_eX]

[DOI]

IET Circuits Devices Syst., 2021

Spatial Selected Spin Filtering Effect in Z-Shaped MoS<sub>2</sub> Nanoribbon.

[BibT_eX]

[DOI]

IEEE Access, 2021

2020

Fully coupled electrothermal simulation of resistive random access memory (RRAM) array.

[BibT_eX]

[DOI]

Sci. China Inf. Sci., 2020

Microwave Planar Sensors for Fully Characterizing Magneto-Dielectric Materials.

[BibT_eX]

[DOI]

IEEE Access, 2020

2019

An Improved Algorithm for Drift Diffusion Transport and Its Application on Large Scale Parallel Simulation of Resistive Random Access Memory Arrays.

[BibT_eX]

[DOI]

IEEE Access, 2019

Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House".

[BibT_eX]

[DOI]

IEEE Access, 2019

2018

A Compact Passive Equalizer Design for Differential Channels in TSV-Based 3-D ICs.

[BibT_eX]

[DOI]

IEEE Access, 2018

Analysis of Cu-Graphene Interconnects.

[BibT_eX]

[DOI]

IEEE Access, 2018

Dawei Wang

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