David Tschopp

According to our database, David Tschopp authored at least 7 papers between 2003 and 2018.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2018

A Dual-Mode NB-IoT and EC-GSM RF-SoC Achieving -128-dBm Extended-Coverage and Supporting OTDOA and A-GPS Positioning.

Matthias Korb, Samuel Willi, Benjamin Weber, Harald Kroll, Andreas Traber, Stefan Altorfer, David Tschopp, Jürgen Rogin, Edwin Dornbierer, Mauro Salomon, Stefan Lippuner, Lianbo Wu, Qiuting Huang

Proceedings of the 44th IEEE European Solid State Circuits Conference, 2018

2017

A SAW-less RF-SoC for cellular IoT supporting EC-GSM-IoT -121.7 dBm sensitivity through EGPRS2A 592 kbps throughput.

Benjamin Weber, Matthias Korb, David Tschopp, Stefan Altorfer, Jürgen Rogin, Harald Kroll, Qiuting Huang

Proceedings of the 43rd IEEE European Solid State Circuits Conference, 2017

2015

An Evolved GSM/EDGE Baseband ASIC Supporting Rx Diversity.

Harald Kröll, Stefan Zwicky, Benjamin Weber, Christoph Roth, David Tschopp, Christian Benkeser, Andreas Peter Burg, Qiuting Huang

IEEE J. Solid State Circuits, 2015

2010

A tri-band SAW-less WCDMA/HSPA RF CMOS transceiver with on-chip DC-DC converter connectable to battery.

Qiuting Huang, Jürgen Rogin, Xinhua Chen, David Tschopp, Thomas Burger, Thomas Christen, Dimitris Papadopoulos, Ilian Kouchev, Chiara Martelli, Thomas Dellsperger

Proceedings of the IEEE International Solid-State Circuits Conference, 2010

A quad-band class-39 RF CMOS receiver for evolved EDGE.

Thomas Dellsperger, David Tschopp, Jürgen Rogin, Yangjian Chen, Thomas Burger, Qiuting Huang

Proceedings of the IEEE International Solid-State Circuits Conference, 2010

2004

A 2-GHz carrier leakage calibrated direct-conversion WCDMA transmitter in 0.13-μm CMOS.

Gabriel Brenna, David Tschopp, Jürgen Rogin, Ilian Kouchev, Qiuting Huang

IEEE J. Solid State Circuits, 2004

2003

A 1.5-V 45-mW direct-conversion WCDMA receiver IC in 0.13-μm CMOS.

Jürgen Rogin, Ilian Kouchev, Gabriel Brenna, David Tschopp, Qiuting Huang

IEEE J. Solid State Circuits, 2003