David Espalin

According to our database, David Espalin authored at least 6 papers between 2014 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Direct Ink-Write Printing of Ceramic Clay with an Embedded Wireless Temperature and Relative Humidity Sensor.

Cory Marquez, Jesus J. Mata, Anabel Renteria, Diego González, Sofia Gabriela Gomez, Alexis Lopez, Annette N. Baca, Alan Nuñez, Md Sahid Hassan, Vincent Burke, Dina Perlasca, Yifeng Wang, Yongliang Xiong, Jessica N. Kruichak, David Espalin, Yirong Lin

Sensors, March, 2023

2019

Electrical and Thermal Characterization of 3D Printed Thermoplastic Parts With Embedded Wires for High Current-Carrying Applications.

Kazi Md Masum Billah, Jose L. Coronel, Michael C. Halbig, Ryan B. Wicker, David Espalin

IEEE Access, 2019

2018

Augmenting Computer-Aided Design Software With Multi-Functional Capabilities to Automate Multi-Process Additive Manufacturing.

Callum Bailey, Efrain Aguilera, David Espalin, Jose Motta, Alfonso Fernández, Mireya A. Perez, Christopher Dibiasio, Dariusz Pryputniewicz, Eric W. MacDonald, Ryan B. Wicker

IEEE Access, 2018

2017

3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect.

Chiyen Kim, David Espalin, Min Liang, Hao Xin, Alejandro Cuaron, Issac Varela, Eric W. MacDonald, Ryan B. Wicker

IEEE Access, 2017

2015

A study to detect a material deposition status in fused deposition modeling technology.

Chiyen Kim, David Espalin, Alejandro Cuaron, Mireya A. Perez, Eric W. MacDonald, Ryan B. Wicker

Proceedings of the IEEE International Conference on Advanced Intelligent Mechatronics, 2015

2014

3D Printing for the Rapid Prototyping of Structural Electronics.

Eric W. MacDonald, Rudy Salas, David Espalin, Mireya Perez, Efrain Aguilera, Dan Muse, Ryan B. Wicker

IEEE Access, 2014