David Bouchu

According to our database, David Bouchu authored at least 6 papers between 2007 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits.

Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2015

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence.

Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün

Microelectron. Reliab., 2015

2010

A successful implementation of dual damascene architecture to copper TSV for 3D high density applications.

Rebha El Farhane, Myriam Assous, Patrick Leduc, Aurélie Thuaire, David Bouchu, Hélène Feldis, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

First integration of Cu TSV using die-to-wafer direct bonding and planarization.

Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2007

Development of a permittivity extraction method for ultra low k dielectrics integrated in advanced interconnects.

Olga Cueto, Myriam Assous, François de Crecy, A. Toffoli, David Bouchu, M. Fayolle, Frédéric Boulanger

Microelectron. Reliab., 2007