Dave Motschman
According to our database1,
Dave Motschman
authored at least 2 papers
between 2011 and 2013.
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Bibliography
2013
Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013
2011
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs.
Proceedings of the 2011 International Symposium on Low Power Electronics and Design, 2011