Dave Motschman

According to our database1, Dave Motschman authored at least 2 papers between 2011 and 2013.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2013
Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013

2011
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs.
Proceedings of the 2011 International Symposium on Low Power Electronics and Design, 2011


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