Dave Harmon

According to our database, Dave Harmon authored at least 3 papers between 2002 and 2008.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2008

Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies.

Fen Chen, O. Bravo, Dave Harmon, Michael A. Shinosky, J. Aitken

Microelectron. Reliab., 2008

2006

Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures.

Fen Chen, J. Gill, Dave Harmon, T. Sullivan, A. Strong, B. Li, H. Rathore, Daniel C. Edelstein

Microelectron. Reliab., 2006

2002

A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO₂ and nitride-oxide dielectrics.

Fen Chen, Rolf-Peter Vollertsen, Baozhen Li, Dave Harmon, Wing L. Lai

Microelectron. Reliab., 2002