Dau Fatt Lim

According to our database, Dau Fatt Lim authored at least 4 papers between 2009 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2012

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement.

Chuan Seng Tan, Dau Fatt Lim, Xiao Fang Ang, J. Wei, K. C. Leong

Microelectron. Reliab., 2012

2011

Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone.

Dau Fatt Lim, K. C. Leong, Chuan Seng Tan

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement.

Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation.

Dau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan

Proceedings of the IEEE International Conference on 3D System Integration, 2009