Daquan Yu
Orcid: 0000-0001-8065-2612
According to our database1,
Daquan Yu
authored at least 9 papers
between 2012 and 2024.
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Timeline
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2024
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Book In proceedings Article PhD thesis Dataset OtherLinks
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Bibliography
2024
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging.
Sensors, 2024
2022
Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter.
Sensors, 2022
2021
A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021
2020
Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application.
Sensors, 2020
Design and Fabrication of High Density 3D IPDs (Integrated Passive Devices) on Glass Substrate.
Proceedings of the 2020 IEEE International Conference on Integrated Circuits, 2020
2016
Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros.
Microelectron. J., 2016
2014
The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer.
Microelectron. Reliab., 2014
2012
Development of reliable low temperature wafer level hermetic bonding using composite seal joint.
Microelectron. Reliab., 2012