Daniel T. Rooney

According to our database, Daniel T. Rooney authored at least 3 papers between 2004 and 2007.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2007

Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules.

Daniel T. Rooney, Louis Gullo, Dongji Xie, N. Todd Castello, Dongkai Shanguan

Microelectron. Reliab., 2007

2005

Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds.

Daniel T. Rooney, DeePak Nager, David Geiger, Dongkai Shanguan

Microelectron. Reliab., 2005

2004

Materials characterization of the effect of mechanical bending on area array package interconnects.

Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie

Microelectron. Reliab., 2004