Daniel H. Jung
Affiliations:- Korea Advanced Institute of Science and Technology, Daejeon, South Korea
According to our database1,
Daniel H. Jung
authored at least 13 papers
between 2013 and 2016.
Collaborative distances:
Collaborative distances:
Timeline
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Bibliography
2016
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.
IEEE Des. Test, 2016
2015
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.
Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015
Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
Fault detection and isolation of multiple defects in through silicon via (TSV) channel.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
2013
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013