Daniel F. Baldwin
According to our database1,
Daniel F. Baldwin
authored at least 4 papers
between 1989 and 2016.
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Bibliography
2016
Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid.
Microelectron. Reliab., 2016
2005
Integrated hardware and software for improved flatness measurement with ATC4.1 flip-chip assembly case study.
IEEE Trans. Instrum. Meas., 2005
1991
An integrated computer aid for generating and evaluating assembly sequences for mechanical products.
IEEE Trans. Robotics Autom., 1991
1989
Proceedings of the IEEE International Conference on Systems, 1989