Daniel Dia

According to our database, Daniel Dia authored at least 3 papers between 2015 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem.

HsinChen Chen, Rolf Lagerquist, Ashish Nayak, Hugh Mair, Gokulakrishnan Manoharan, Ericbill Wang, Gordon Gammie, Efron Ho, Anand Rajagopalan, Lee-Kee Yong, Ramu Madhavaram, Madhur Jagota, Chi-Jui Chung, Sudhakar Maruthi, Jenny Wiedemeier, Tao Chen, Henry Hsieh, Daniel Dia, Amjad Sikiligiri, Manzur Rahman, Barry Chen, Curtis Lin, Vincent Lin, Elly Chiang, Cheng-Yuh Wu, Po-Yang Hsu, Jason Tsai, Wade Wu, Achuta Thippana, S. A. Huang

Proceedings of the IEEE International Solid-State Circuits Conference, 2021

2017

3.4 A 10nm FinFET 2.8GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance.

Hugh Mair, Ericbill Wang, Alice Wang, Ping Kao, Yuwen Tsai, Sumanth Gururajarao, Rolf Lagerquist, Jin Son, Gordon Gammie, Gordon Lin, Achuta Thippana, Kent Li, Manzur Rahman, Wuan Kuo, David Yen, Yi-Chang Zhuang, Ue Fu, Hung-Wei Wang, Mark Peng, Cheng-Yuh Wu, Taner Dosluoglu, Anatoly Gelman, Daniel Dia, Girishankar Gurumurthy, Tony Hsieh, W. X. Lin, Ray Tzeng, Jengding Wu, C. H. Wang, Uming Ko

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

2015

23.3 A highly integrated smartphone SoC featuring a 2.5GHz octa-core CPU with advanced high-performance and low-power techniques.

Hugh Mair, Gordon Gammie, Alice Wang, Sumanth Gururajarao, Ichiro Lin, HsinChen Chen, Wuan Kuo, Anand Rajagopalan, Wei-Zheng Ge, Rolf Lagerquist, Syed Rahman, C. J. Chung, Simon Wang, Lee-Kee Wong, Yi-Chang Zhuang, Kent Li, Jidong Wang, Minh Chau, Yijing Liu, Daniel Dia, Mark Peng, Uming Ko

Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015