Danian Dong
Orcid: 0000-0002-9740-687X
According to our database1,
Danian Dong
authored at least 13 papers
between 2019 and 2024.
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Bibliography
2024
Hardware Implementation of Next Generation Reservoir Computing with RRAM-Based Hybrid Digital-Analog System.
Adv. Intell. Syst., October, 2024
2023
A 40-nm SONOS Digital CIM Using Simplified LUT Multiplier and Continuous Sample-Hold Sense Amplifier for AI Edge Inference.
IEEE Trans. Very Large Scale Integr. Syst., December, 2023
Nat. Mac. Intell., February, 2023
2022
A 13 µW Analog Front-End with RRAM-Based Lowpass FIR Filter for EEG Signal Detection.
Sensors, 2022
Mixed-Precision Continual Learning Based on Computational Resistance Random Access Memory.
Adv. Intell. Syst., 2022
Few-shot graph learning with robust and energy-efficient memory-augmented graph neural network (MAGNN) based on homogeneous computing-in-memory.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
3D Reservoir Computing with High Area Efficiency (5.12 TOPS/mm<sup>2</sup>) Implemented by 3D Dynamic Memristor Array for Temporal Signal Processing.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
First Demonstration of High-Sensitivity (NEP 1fW<sup>1/2</sup>) Back-Illuminated Active-Matrix Deep UV Image Sensor by Monolithic Integration of Ga2O3 Photodetectors and Oxide Thin-Film-Transistors.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
2021
24.2 A 14nm-FinFET 1Mb Embedded 1T1R RRAM with a 0.022µ m<sup>2</sup> Cell Size Using Self-Adaptive Delayed Termination and Multi-Cell Reference.
Proceedings of the IEEE International Solid-State Circuits Conference, 2021
Proceedings of the IEEE International Memory Workshop, 2021
Effect of conductive filament morphology on soft error of oxide based Resistive Random Access Memory.
Proceedings of the 2021 IEEE International Conference on Integrated Circuits, 2021
2019
A 0.75 V reference clamping sense amplifier for low-power high-density ReRAM with dynamic pre-charge technique.
IEICE Electron. Express, 2019