Dan Wallace

According to our database, Dan Wallace authored at least 1 paper in 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2010

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications.

Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen

Proceedings of the IEEE International Conference on 3D System Integration, 2010