Daire Breathnach

According to our database, Daire Breathnach authored at least 6 papers between 2014 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

A 13Bit 5GS/S ADC with Time-Interleaved Chopping Calibration in 16NM FinFET.

Bruno Vaz, Bob Verbruggen, Christophe Erdmann, Diarmuid Collins, John McGrath, Ali Boumaalif, Edward Cullen, Darragh Walsh, Alonso Morgado, Conrado Mesadri, Brian Long, Rajitha Pathepuram, Ronnie De La Torre, Alvin Manlapat, Georgios Karyotis, Dimitris Tsaliagos, Patrick Lynch, Peng Lim, Daire Breathnach, Brendan Farley

Proceedings of the 2018 IEEE Symposium on VLSI Circuits, 2018

A modular 16NM Direct-RF TX/RX Embedding 9GS/S DAC and 4.5GS/S ADC with 90DB Isolation and Sub-80PS Channel Alignment for Monolithic Integration in 5G Base-Station SoC.

Christophe Erdmann, Bob Verbruggen, Bruno Vaz, Roberto Pelliconi, John McGrath, Ryan Kinnerk, Ronnie De La Torre, John O'Dwyer, Patrick Lynch, Padraig Kelly, Peng Lim, Daire Breathnach, Brendan Farley

Proceedings of the 2018 IEEE Symposium on VLSI Circuits, 2018

2017

16.1 A 13b 4GS/s digitally assisted dynamic 3-stage asynchronous pipelined-SAR ADC.

Bruno Vaz, Adrian Lynam, Bob Verbruggen, Asma Laraba, Conrado Mesadri, Ali Boumaalif, John McGrath, Umanath Kamath, Ronnie De La Torre, Alvin Manlapat, Daire Breathnach, Christophe Erdmann, Brendan Farley

Proceedings of the 2017 IEEE International Solid-State Circuits Conference, 2017

A programmable RFSoC in 16nm FinFET technology for wideband communications.

Brendan Farley, Christophe Erdmann, Bruno Vaz, John McGrath, Edward Cullen, Bob Verbruggen, Roberto Pelliconi, Daire Breathnach, Peng Lim, Ali Boumaalif, Patrick Lynch, Conrado Mesadri, David Melinn, Kwee Peng Yap, Liam Madden

Proceedings of the IEEE Asian Solid-State Circuits Conference, 2017

2015

A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters.

Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden

IEEE J. Solid State Circuits, 2015

2014

6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters.

Christophe Erdmann, Donnacha Lowney, Adrian Lynam, Aidan Keady, John McGrath, Edward Cullen, Daire Breathnach, Denis Keane, Patrick Lynch, Marites De La Torre, Ronnie De La Torre, Peng Lim, Anthony Collins, Brendan Farley, Liam Madden

Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014