Dai-Ying Lee

According to our database1, Dai-Ying Lee authored at least 2 papers between 2022 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2024
Engineering HZO by Flat Amorphous TiN with 0.3nm Roughness Achieving Uniform c-Axis Alignment, Record High Breakdown Field (~10nm HZO), and Record Final 2Pr of 56 μC/cm<sup>2</sup> with Endurance > 4E12.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2022
NOR Flash-based Multilevel In-Memory-Searching Architecture for Approximate Computing.
Proceedings of the IEEE International Memory Workshop, 2022


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