Daeyong Shim
According to our database1,
Daeyong Shim
authored at least 5 papers
between 2013 and 2022.
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Bibliography
2022
Proceedings of the IEEE International Symposium on Circuits and Systems, 2022
2020
22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarter Bank Structure, Power Dispersion and an Instruction-Based At-Speed PMBIST.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020
2018
A 1.2V 64Gb 341GB/S HBM2 stacked DRAM with spiral point-to-point TSV structure and improved bank group data control.
Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018
2016
A Sub-1.0-V On-Chip CMOS Thermometer With a Folded Temperature Sensor for Low-Power Mobile DRAM.
IEEE Trans. Circuits Syst. II Express Briefs, 2016
2013
A Process-Variation-Tolerant On-Chip CMOS Thermometer for Auto Temperature Compensated Self-Refresh of Low-Power Mobile DRAM.
IEEE J. Solid State Circuits, 2013