Dae Whan Kim
According to our database1,
Dae Whan Kim
authored at least 3 papers
between 2006 and 2017.
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Bibliography
2017
IEEE Trans. Ind. Electron., 2017
2012
Proceedings of the 2012 IEEE Haptics Symposium, 2012
2006
The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump.
Microelectron. Reliab., 2006