Dae-Gon Kim

According to our database1, Dae-Gon Kim authored at least 2 papers between 2006 and 2008.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of six.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
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Links

On csauthors.net:

Bibliography

2008
Effect of high-speed loading conditions on the fracture mode of the BGA solder joint.
Microelectron. Reliab., 2008

2006
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application.
Microelectron. Reliab., 2006


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