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D. Y. Luk

According to our database1, D. Y. Luk authored at least 2 papers in 2002.

Collaborative distances:
  • no known Dijkstra number2.
  • no known Erdős number3.

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Bibliography

2002
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure.
[BibTeX]
[DOI]
Y. C. Chan
,
D. Y. Luk
Microelectron. Reliab., 2002

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature.
[BibTeX]
[DOI]
Y. C. Chan
,
D. Y. Luk
Microelectron. Reliab., 2002


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