D. J. Bergstrom

According to our database, D. J. Bergstrom authored at least 4 papers between 2005 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2012

Modeling of Cell Cultures in Perfusion Bioreactors.

Xin Yan, D. J. Bergstrom, X. B. Chen

IEEE Trans. Biomed. Eng., 2012

2008

Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging.

J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom

Microelectron. Reliab., 2008

2007

Recent advances in modeling the underfill process in flip-chip packaging.

J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom

Microelectron. J., 2007

2005

Influence of transient flow and solder bump resistance on underfill process.

J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom

Microelectron. J., 2005