Curtis Lin

According to our database, Curtis Lin authored at least 2 papers between 2021 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

A 5nm 3.4GHz Tri-Gear ARMv9 CPU Subsystem in a Fully Integrated 5G Flagship Mobile SoC.

Ashish Nayak, HsinChen Chen, Hugh Mair, Rolf Lagerquist, Tao Chen, Anand Rajagopalan, Gordon Gammie, Ramu Madhavaram, Madhur Jagota, C. J. Chung, Jenny Wiedemeier, Bala Meera, Chao-Yang Yeh, Maverick Lin, Curtis Lin, Vincent Lin, Jiun Lin, Y. S. Chen, Barry Chen, Cheng-Yuh Wu, Ryan ChangChien, Ray Tzeng, Kelvin Yang, Achuta Thippana, Ericbill Wang, Shih-Arn Hwang

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2021

A 7nm 5G Mobile SoC Featuring a 3.0GHz Tri-Gear Application Processor Subsystem.

HsinChen Chen, Rolf Lagerquist, Ashish Nayak, Hugh Mair, Gokulakrishnan Manoharan, Ericbill Wang, Gordon Gammie, Efron Ho, Anand Rajagopalan, Lee-Kee Yong, Ramu Madhavaram, Madhur Jagota, Chi-Jui Chung, Sudhakar Maruthi, Jenny Wiedemeier, Tao Chen, Henry Hsieh, Daniel Dia, Amjad Sikiligiri, Manzur Rahman, Barry Chen, Curtis Lin, Vincent Lin, Elly Chiang, Cheng-Yuh Wu, Po-Yang Hsu, Jason Tsai, Wade Wu, Achuta Thippana, S. A. Huang

Proceedings of the IEEE International Solid-State Circuits Conference, 2021