Cong Pan

Orcid: 0000-0002-4955-7761

Affiliations:
  • China Electronics Product Reliability and Environmental Testing Research Institute, China
  • Beihang University, China (former)


According to our database1, Cong Pan authored at least 3 papers between 2018 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

2018
2019
2020
2021
2022
2023
0
1
2
1
1
1

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2023
A Framework of Operational Profile for AI Systems.
Proceedings of the 2023 International Conference on Information Education and Artificial Intelligence, 2023

2021
Continuous test suite failure prediction.
Proceedings of the ISSTA '21: 30th ACM SIGSOFT International Symposium on Software Testing and Analysis, 2021

2018
Qualitative Software Reliability Requirements: Concept, Classification and Practical Elicitation Methods.
Proceedings of the 2018 IEEE International Conference on Software Quality, 2018


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