Claudius Feger

According to our database1, Claudius Feger authored at least 4 papers between 2005 and 2011.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of six.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2011
Thermal fracture toughness measurement for underfill during temperature change.
Microelectron. Reliab., 2011

Packaging issues for 22nm and beyond.
Proceedings of the 24th Symposium on Integrated Circuits and Systems Design, 2011

2005
Mixing, rheology, and stability of highly filled thermal pastes.
IBM J. Res. Dev., 2005

Effects of mechanical stress and moisture on packaging interfaces.
IBM J. Res. Dev., 2005


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