Claire Fenouillet-Béranger

According to our database, Claire Fenouillet-Béranger authored at least 24 papers between 2009 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

First Radio-Frequency Circuits Fabricated in Top-Tier of a Full 3D Sequential Integration Process at mmW for 5G Applications.

J. Luge-Alvarez, J. B. David, Alexandre Siligaris, Vincent Puyal, G. Moritz, Tadeu Mota Frutuoso, V. Lapras, Claire Fenouillet-Béranger, Laurent Brunet, P. Vincent, Didier Lattard, Xavier Garros, François Andrieu, Perrine Batude

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2023

Radar-Based Human Activity Acquisition, Classification and Recognition Towards Elderly Fall Prediction.

Claire Fenouillet-Béranger, Alexandre Bordat, Mohamed Amine Khelif, Petr Dobiás, Ngoc-Son Vu, Julien Le Kernec, David Guyard, Olivier Romain

Proceedings of the 26th Euromicro Conference on Digital System Design, 2023

2022

Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration.

Tadeu Mota Frutuoso, Xavier Garros, Perrine Batude, Laurent Brunet, Joris Lacord, Benoit Sklénard, V. Lapras, Claire Fenouillet-Béranger, M. Ribotta, A. Magalhaes-Lucas, J. Kanyandekwe, R. Kies, G. Romano, Edoardo Catapano, Mikaël Cassé, Jose Lugo-Alvarez, Philippe Ferrari, Fred Gaillard

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2021

Impact of spacer interface charges on performance and reliability of low temperature transistors for 3D sequential integration.

Tadeu Mota Frutuoso, Jose Lugo-Alvarez, Xavier Garros, Laurent Brunet, Joris Lacord, Louis Gerrer, Mikaël Cassé, Edoardo Catapano, Claire Fenouillet-Béranger, François Andrieu, Fred Gaillard, Philippe Ferrari

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2018

Role of synaptic variability in spike-based neuromorphic circuits with unsupervised learning.

Denys R. B. Ly, Alessandro Grossi, Thilo Werner, Thomas Dalgaty, Claire Fenouillet-Béranger, Elisa Vianello, Etienne Nowak

Proceedings of the IEEE International Symposium on Circuits and Systems, 2018

A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit.

François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, Didier Lattard, Sébastien Thuries, Olivier Billoint, Richard Fournel, Maud Vinet

Proceedings of the 2018 International Conference on IC Design & Technology, 2018

2017

Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells.

Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint

Proceedings of the 2017 IEEE Computer Society Annual Symposium on VLSI, 2017

Precise EOT regrowth extraction enabling performance analysis of low temperature extension first devices.

Jessy Micout, Quentin Rafhay, Xavier Garros, Mikaël Cassé, Jean Coignus, Luca Pasini, Cao-Minh Vincent Lu, Nils Rambal, Claire Fenouillet-Béranger, Laurent Brunet, G. Romano, R. Gassilloud, Perrine Batude, Maud Vinet, Gérard Ghibaudo

Proceedings of the 47th European Solid-State Device Research Conference, 2017

Guidelines for intermediate back end of line (BEOL) for 3D sequential integration.

Claire Fenouillet-Béranger, S. Beaurepaire, Fabien Deprat, Alexandre Ayres De Sousa, Laurent Brunet, Perrine Batude, Olivier Rozeau, François Andrieu, Paul Besombes, M.-P. Samson, Bernard Previtali, F. Nemouchi, G. Rodriguez, Philippe Rodriguez, R. Famulok, Nils Rambal, Viorel Balan, Z. Saghi, V. Jousseaume, Charles-Antoine Guérin, F. Ibars, F. Proud, D. Nouguier, David Ney, V. Delaye, H. Dansas, X. Federspiel, Maud Vinet

Proceedings of the 47th European Solid-State Device Research Conference, 2017

2016

Recent advances in 3D VLSI integration.

Claire Fenouillet-Béranger, Perrine Batude, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, M.-P. Samson, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Gerald Cibrario, Maud Vinet

Proceedings of the International Conference on IC Design and Technology, 2016

Opportunities brought by sequential 3D CoolCube™ integration.

Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot

Proceedings of the 46th European Solid-State Device Research Conference, 2016

Impact of intermediate BEOL technology on standard cell performances of 3D VLSI.

Melanie Brocard, Guillaume Berhault, Sébastien Thuries, Fabien Clermidy, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, François Andrieu, Fabien Deprat, Joris Lacord, Olivier Rozeau, Gerald Cibrario, Olivier Billoint

Proceedings of the 46th European Solid-State Device Research Conference, 2016

Towards high density 3D interconnections.

Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges.

Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, Ogun Turkyilmaz, Sébastien Thuries, Fabien Clermidy

Proceedings of the 2015 Symposium on International Symposium on Physical Design, ISPD 2015, Monterey, CA, USA, March 29, 2015

Benefit of Al2O3/HfO2 bilayer for BEOL RRAM integration through 16kb memory cut characterization.

M. Azzaz, A. Benoist, Elisa Vianello, Daniele Garbin, Eric Jalaguier, Carlo Cagli, C. Charpin, Stefania Bernasconi, Simon Jeannot, T. Dewolf, G. Audoit, C. Guedj, S. Denorme, Philippe Candelier, Claire Fenouillet-Béranger, Luca Perniola

Proceedings of the 45th European Solid State Device Research Conference, 2015

A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool.

Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, A. Fustier, Julien Michallet, Olivier Faynot, Ogun Turkyilmaz, Jean-Frédéric Christmann, Sébastien Thuries, Fabien Clermidy

Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, 2015

Intermediate BEOL process influence on power and performance for 3DVLSI.

Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Deprat, Alexandre Ayres De Sousa, Perrine Batude, Claire Fenouillet-Béranger, Fabien Clermidy

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration.

Claire Fenouillet-Béranger, Bernard Previtali, Perrine Batude, Fabrice Nemouchi, Mikaël Cassé, Xavier Garros, Lucie Tosti, Nils Rambal, Dominique Lafond, Hugo Dansas, Luca Pasini, Laurent Brunet, Fabien Deprat, Magali Grégoire, M. Mellier, Maud Vinet

Proceedings of the 44th European Solid State Device Research Conference, 2014

2013

Novel back-biased UTBB lateral SCR for FDSOI ESD protections.

Yohann Solaro, Pascal Fonteneau, Charles-Alexandre Legrand, Claire Fenouillet-Béranger, Philippe Ferrari, Sorin Cristoloveanu

Proceedings of the European Solid-State Device Research Conference, 2013

2012

Multibranch mobility characterization: Evidence of carrier mobility enhancement by back-gate biasing in FD-SOI MOSFET.

Carlos Navarro, Noel Rodriguez, Luca Donetti, Akiko Oliata, Francisco Gámiz, François Andrieu, Olivier Faynot, Claire Fenouillet-Béranger, Sorin Cristoloveanu

Proceedings of the 2012 European Solid-State Device Research Conference, 2012

New parameter extraction method based on split C-V for FDSOI MOSFETs.

Imed Ben Akkez, Antoine Cros, Claire Fenouillet-Béranger, Frédéric Boeuf, Quentin Rafhay, Francis Balestra, Gérard Ghibaudo

Proceedings of the 2012 European Solid-State Device Research Conference, 2012

2010

32nm and beyond Multi-VT Ultra-Thin Body and BOX FDSOI: From device to circuit.

Olivier Thomas, Jean-Philippe Noel, Claire Fenouillet-Béranger, Marie-Anne Jaud, J. Dura, P. Perreau, Frédéric Boeuf, François Andrieu, D. Delprat, F. Boedt, Konstantin Bourdelle, Bich-Yen Nguyen, Andrei Vladimirescu, Amara Amara

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2010), May 30, 2010

2009

Process dependence of BTI reliability in advanced HK MG stacks.

Xavier Garros, Mikaël Cassé, M. Rafik, Claire Fenouillet-Béranger, Gilles Reimbold, François Martin, Claudia Wiemer, F. Boulanger

Microelectron. Reliab., 2009

Impact of a 10nm Ultra-Thin BOX (UTBOX) and Ground Plane on FDSOI devices for 32nm node and below.

Claire Fenouillet-Béranger, P. Perreau, S. Denorme, L. Tosti, François Andrieu, Olivier Weber, S. Barnola, C. Arvet, Y. Campidelli, Sébastien Haendler, R. Beneyton, C. Perrot, C. de Buttet, P. Gros, Loan Pham-Nguyen, F. Leverd, P. Gouraud, F. Abbate, F. Baron, A. Torres, C. Laviron, L. Pinzelli, J. Vetier, C. Borowiak, A. Margain, D. Delprat, F. Boedt, Konstantin Bourdelle, Bich-Yen Nguyen, Olivier Faynot, Thomas Skotnicki

Proceedings of the 35th European Solid-State Circuits Conference, 2009