Chunyan Yin

According to our database, Chunyan Yin authored at least 12 papers between 2003 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2021

Evolutionary Social Poisson Factorizationfor Temporal Recommendation.

Chunyan Yin, Yongheng Chen, Wanli Zuo

Int. J. Comput. Intell. Syst., 2021

2019

Data analytics to reduce stop-on-fail test in electronics manufacturing.

Ana Elsa Hinojosa Herrera, Stoyan Stoyanov, Chris Bailey, Chris Walshaw, Chunyan Yin

Open Comput. Sci., 2019

Novel gridded descriptors of poincaré plot for analyzing heartbeat interval time-series.

Chang Yan, Peng Li, Changchun Liu, Xinpei Wang, Chunyan Yin, Lianke Yao

Comput. Biol. Medicine, 2019

Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications.

Fateme Dinmohammadi, David Flynn, Chris Bailey, Michael G. Pecht, Chunyan Yin, Pushparajah Rajaguru, Valentin Robu

IEEE Access, 2019

2018

Multi-modal multi-layered topic classification model for social event analysis.

Yongheng Chen, Chunyan Yin, Yaojin Lin, Wanli Zuo

Multim. Tools Appl., 2018

An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.

Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey

Microelectron. Reliab., 2018

On-line Evolutionary Sentiment Topic Analysis Modeling.

Yongheng Chen, Chunyan Yin, Yaojin Lin, Wanli Zuo

Int. J. Comput. Intell. Syst., 2018

2015

Statistical analysis of the impact of refinishing process on leaded components.

Chunyan Yin, Chris Best, Chris Bailey, Stoyan Stoyanov

Microelectron. Reliab., 2015

2014

Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules.

Mahera Musallam, Chunyan Yin, Chris Bailey, C. Mark Johnson

Microelectron. Reliab., 2014

2013

Modelling methodology for thermal analysis of hot solder dip process.

Stoyan Stoyanov, Chris Bailey, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott

Microelectron. Reliab., 2013

2009

Design for reliability of power electronics modules.

Hua Lu, Chris Bailey, Chunyan Yin

Microelectron. Reliab., 2009

2003

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.

Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey, Hua Lu

Microelectron. Reliab., 2003