Chunpu Lv
Orcid: 0000-0002-9924-144X
According to our database1,
Chunpu Lv
authored at least 3 papers
between 2021 and 2023.
Collaborative distances:
Collaborative distances:
Timeline
2021
2022
2023
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1
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1
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Bibliography
2023
Semi-Supervised Deep Kernel Active Learning for Material Removal Rate Prediction in Chemical Mechanical Planarization.
Sensors, 2023
2022
Material Removal Rate Prediction with Phase Sensitive Variables Selection and Phase Partition.
Proceedings of the 27th International Conference on Automation and Computing, 2022
2021
Phase Partition Based Virtual Metrology for Material Removal Rate Prediction in Chemical Mechanical Planarization Process.
Proceedings of the Artificial Intelligence - First CAAI International Conference, 2021