Chunpu Lv

According to our database, Chunpu Lv authored at least 3 papers between 2021 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Semi-Supervised Deep Kernel Active Learning for Material Removal Rate Prediction in Chemical Mechanical Planarization.

Chunpu Lv, Jingwei Huang, Ming Zhang, Huangang Wang, Tao Zhang

Sensors, 2023

2022

Material Removal Rate Prediction with Phase Sensitive Variables Selection and Phase Partition.

Chunpu Lv, Tao Zhang, Huangang Wang

Proceedings of the 27th International Conference on Automation and Computing, 2022

2021

Phase Partition Based Virtual Metrology for Material Removal Rate Prediction in Chemical Mechanical Planarization Process.

Wenlan Jiang, Chunpu Lv, Tao Zhang, Huan-gang Wang

Proceedings of the Artificial Intelligence - First CAAI International Conference, 2021