Chun K. Lim

According to our database, Chun K. Lim authored at least 3 papers in 1993.

Collaborative distances:

• no known Dijkstra number.
• no known Erdős number.

1993

Preface.

Chun K. Lim, Thomas Caulfield, Joseph Benenati

IBM J. Res. Dev., 1993

Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation.

Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik

IBM J. Res. Dev., 1993

Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations.

Hyung-Chu Choi, Yifan Guo, William LaFontaine, Chun K. Lim

IBM J. Res. Dev., 1993