Chun-Hsien Chien

According to our database, Chun-Hsien Chien authored at least 2 papers in 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Performance and process characteristic of glass interposer with through-glass-via(TGV).

Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean Lu

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer.

Jui-Chin Chen, John H. Lau, Tzu-Chien Hsu, Chien-Chou Chen, Pei-Jer Tzeng, Po-Chih Chang, Chun-Hsien Chien, Yiu-Hsiang Chang, Shang-Chun Chen, Yu-Chen Hsin, Sue-Chen Liao, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013