Christophe Maleville

According to our database, Christophe Maleville authored at least 6 papers between 2012 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Efficient integrated devices are growing on Engineered Substrates.

Christophe Maleville

Proceedings of the International Conference on IC Design and Technology, 2023

Investigation of Random Telegraph Noise in Advanced Silicon-On-Insulator N-FETs: The Impact of Back Bias, Strain, and Hot Carrier Stress.

Xinze Li, Yuxuan Wu, Qiao Teng, Ying Sun, Xiao Gong, Guillaume Besnard, Christophe Maleville, Olivier Weber, Rui Zhang, Bing Chen, Dawei Gao, Ran Cheng

Proceedings of the International Conference on IC Design and Technology, 2023

2022

Engineered SiC materials for power technologies.

Walter Schwarzenbach, S. Rouchier, G. Berre, R. Boulet, O. Ledoux, Enrica Cela, Alexis Drouin, A. Chapelle, S. Monnoye, H. Biard, K. Alassaad, L. Viravaux, N. Ben Mohamed, D. Radisson, G. Picun, G. Lavaitte, A. Bouville-Lallart, J. Roi, J. Widiez, K. Abadie, E. Rolland, F. Fournel, G. Gélineau, F. Mazen, A. Moulin, C. Moulin, D. Delprat, N. Daval, S. Odoul, P. Sandri, Christophe Maleville

Proceedings of the International Conference on IC Design and Technology, 2022

Smart Cut^™ technology: from Substrate Enginnering to Advanced 3D Integration.

Guillaume Besnard, Bich-Yen Nguyen, Christophe Maleville

Proceedings of the International Conference on IC Design and Technology, 2022

2017

FD-SOI material enabling CMOS technology disruption from 65nm to 12nm and beyond.

Walter Schwarzenbach, Manuel Sellier, Bich-Yen Nguyen, Christophe Girard, Christophe Maleville

Proceedings of the 2017 IEEE International Conference on IC Design and Technology, 2017

2012

Strained silicon on insulator substrates for fully depleted application.

Walter Schwarzenbach, N. Daval, S. Kerdiles, G. Chabanne, C. Figuet, S. Guerroudj, O. Bonnin, X. Cauchy, Bich-Yen Nguyen, Christophe Maleville

Proceedings of the IEEE International Conference on IC Design & Technology, 2012