Christof Landesberger

According to our database, Christof Landesberger authored at least 4 papers between 2007 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Analysis of Piezoresistive Silicon as Sense Element for use in Flexible Tactile Sensors.

Vartika Verma, Eslam Ahmed, Nicola Kovac, Christof Landesberger, Horst A. Gieser, Ralf Brederlow

Proceedings of the 2024 IEEE SENSORS, Kobe, Japan, October 20-23, 2024, 2024

2019

Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration.

Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Low Profile Open MEMS and ASIC Packages manufactured by Flexible Hybrid Integration in a Roll-to-Roll compatible process.

Indranil Bose, Nagarajan Palavesam, Christian Hochreiter, Christof Landesberger, Christoph Kutter

Proceedings of the 48th European Solid-State Device Research Conference, 2018

2007

Investigations of the influence of dicing techniques on the strength properties of thin silicon.

Stephan Schoenfelder, Matthias Ebert, Christof Landesberger, Karlheinz Bock, Jörg Bagdahn

Microelectron. Reliab., 2007