Christian Chancel

According to our database1, Christian Chancel authored at least 2 papers in 2016.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2016
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.
IEEE Des. Test, 2016

Heat spreading packaging solutions for hybrid bonded 3D-ICs.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016


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