Chris Bailey

According to our database, Chris Bailey authored at least 32 papers between 2002 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module.

Pushparajah Rajaguru, Tim Tilford, Chris Bailey, Stoyan Stoyanov

IEEE Access, 2024

2023

Modeling Insights Into the Assembly Challenges of Focal Plane Arrays.

Stoyan Stoyanov, Chris Bailey

IEEE Access, 2023

2020

Developing Computational Intelligence for Smart Qualification Testing of Electronic Products.

Mominul Ahsan, Stoyan Stoyanov, Chris Bailey, Alhussein Albarbar

IEEE Access, 2020

2019

Predictive analytics methodology for smart qualification testing of electronic components.

Stoyan Stoyanov, Mominul Ahsan, Chris Bailey, Tracy Wotherspoon, Craig Hunt

J. Intell. Manuf., 2019

Data analytics to reduce stop-on-fail test in electronics manufacturing.

Ana Elsa Hinojosa Herrera, Stoyan Stoyanov, Chris Bailey, Chris Walshaw, Chunyan Yin

Open Comput. Sci., 2019

Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications.

Fateme Dinmohammadi, David Flynn, Chris Bailey, Michael G. Pecht, Chunyan Yin, Pushparajah Rajaguru, Valentin Robu

IEEE Access, 2019

2018

Design, manufacture and test for reliable 3D printed electronics packaging.

Tim Tilford, Stoyan Stoyanov, Jessica B. S. Langbaum, Jan Christoph Janhsen, Matthias Burgard, Richard B. Buxton, Chris Bailey

Microelectron. Reliab., 2018

Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables.

Pushparajah Rajaguru, H. Lu, Chris Bailey, Alberto Castellazzi, V. Pathirana, N. Udugampola, Florin Udrea

Microelectron. Reliab., 2018

An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.

Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey

Microelectron. Reliab., 2018

Analysis of Sandstone Pore Space Fluid Saturation and Mineralogy Variation via Application of Monostatic K-Band Frequency Modulated Continuous Wave Radar.

Jamie Blanche, David Flynn, Helen Lewis, Gary D. Couples, Jim Buckman, Chris Bailey, Tim Tilford

IEEE Access, 2018

2017

Evaluation of SiC Schottky Diodes Using Pressure Contacts.

Jose Angel Ortiz Gonzalez, Olayiwola Alatise, Attahir Murtala Aliyu, Pushparajah Rajaguru, Alberto Castellazzi, Li Ran, Philip Mawby, Chris Bailey

IEEE Trans. Ind. Electron., 2017

Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.

Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise

Microelectron. Reliab., 2017

2016

Similarity approach for reducing qualification tests of electronic components.

Stoyan Stoyanov, Chris Bailey, Georgios Tourloukis

Microelectron. Reliab., 2016

2015

Statistical analysis of the impact of refinishing process on leaded components.

Chunyan Yin, Chris Best, Chris Bailey, Stoyan Stoyanov

Microelectron. Reliab., 2015

Modelling the impact of refinishing processes on COTS components for use in aerospace applications.

Stoyan Stoyanov, Chris Bailey

Microelectron. Reliab., 2015

A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module.

Pushparajah Rajaguru, Hua Lu, Chris Bailey

Microelectron. Reliab., 2015

Sintered silver finite element modelling and reliability based design optimisation in power electronic module.

Pushparajah Rajaguru, Hua Lu, Chris Bailey

Microelectron. Reliab., 2015

2014

Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules.

Mahera Musallam, Chunyan Yin, Chris Bailey, C. Mark Johnson

Microelectron. Reliab., 2014

New topic session 2B: Co-design and reliability of power electronic modules - Current status and future challenges.

Bozena Kaminska, Bernard Courtois, Chris Bailey

Proceedings of the 32nd IEEE VLSI Test Symposium, 2014

2013

Modelling methodology for thermal analysis of hot solder dip process.

Stoyan Stoyanov, Chris Bailey, M. O. Alam, Chunyan Yin, Chris Best, Peter Tollafield, Rob Crawford, Mike Parker, Jim Scott

Microelectron. Reliab., 2013

2012

Prognostics and Health Monitoring of High Power LED.

Thamo Sutharssan, Stoyan Stoyanov, Chris Bailey, Yasmine Z. Rosunally

Micromachines, 2012

2011

Fusion Approach for Prognostics Framework of Heritage Structure.

Yasmine Z. Rosunally, Stoyan Stoyanov, Chris Bailey, Peter Mason, Sheelagh Campbell, George Monger, Ian Bell

IEEE Trans. Reliab., 2011

Integration of analytical techniques in stochastic optimization of microsystem reliability.

Xiangdong Xue, Chris Bailey, Hua Lu, Stoyan Stoyanov

Microelectron. Reliab., 2011

2010

A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects.

E. Kamara, Hua Lu, Chris Bailey, Chris Hunt, Davide Di Maio, Owen Thomas

Microelectron. Reliab., 2010

2009

Design for reliability of power electronics modules.

Hua Lu, Chris Bailey, Chunyan Yin

Microelectron. Reliab., 2009

2008

Failure mechanisms of ACF joints under isothermal ageing.

M. J. Rizvi, Chris Bailey, Hua Lu

Microelectron. J., 2008

Open Ended Microwave Oven for Packaging

Keith I. Sinclair, Tim Tilford, Marc P. Y. Desmulliez, George Goussetis, Chris Bailey, Kevin Parrott, Alan J. Sangster

CoRR, 2008

2007

Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives.

Stoyan Stoyanov, Robert W. Kay, Chris Bailey, Marc P. Y. Desmulliez

Microelectron. Reliab., 2007

2006

Assessing the performance of crack detection tests for solder joints.

Stephen Ridout, Milos Dusek, Chris Bailey, Chris Hunt

Microelectron. Reliab., 2006

2005

Study of anisotropic conductive adhesive joint behavior under 3-point bending.

M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu

Microelectron. Reliab., 2005

2003

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.

Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey, Hua Lu

Microelectron. Reliab., 2003

2002

No-flow underfill flip chip assembly--an experimental and modeling analysis.

Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan

Microelectron. Reliab., 2002