Choong-Un Kim

According to our database, Choong-Un Kim authored at least 4 papers between 2020 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Study of Thermomechanical Damage Mechanism in Al Interconnects in Al-SiO2 structure by High Density Peak Current.

Hariram Mohanram, Harikrishnan Kumarasamy, Choong-Un Kim, Young-Joon Park, Srikanth Krishnan

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023

Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects.

Jorge Mendoza, Jimmy-Bao Le, Choong-Un Kim, Hung-Yun Lin

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2021

Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages.

Allison T. Osmanson, Mohsen Tajedini, Yi Ram Kim, Hossein Madanipour, Choong-Un Kim, Bradley Glasscock, Muhammad Khan

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects.

Yi Ram Kim, Allison T. Osmanson, Hossein Madanipour, Choong-Un Kim, Patrick F. Thompson, Qiao Chen

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020