Chong Leong Gan

According to our database, Chong Leong Gan authored at least 8 papers between 2014 and 2017.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2017

Soft error mechanisms, modeling and mitigation. Springer (2016).

Chong Leong Gan, Mohamad Zainudeen Moideen

Microelectron. Reliab., 2017

Book Review: Carbon Nanotubes for Interconnects: Process, Design and Applications (2017), Springer, ISBN: ISBN 978-3-319-29744-6 (Print) ISBN 978-3-319-29746-0 (Online).

Chong Leong Gan, Mohamad Zainudeen Moideen

Microelectron. Reliab., 2017

2016

3D Flash Memories.

Chong Leong Gan, Uda Hashim

Microelectron. Reliab., 2016

3D Stacked Chips: from Emerging Processes to Heterogeneous Systems. Springer (2016), ISBN: 978-3-319-20481-9.

Chong Leong Gan, Uda Hashim

Microelectron. Reliab., 2016

Book Review: Fundamentals of Bias Temperature Instability in MOS Transistors. Springer (2016).

Chong Leong Gan

Microelectron. Reliab., 2016

2015

Wafer-Level Chip-Scale Packaging (Analog and Power Electronics Packaging), XVII. Springer (2015), 322, ISBN: 978-1-4939-1555-2.

Chong Leong Gan, Uda Hashim

Microelectron. Reliab., 2015

Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online).

Chong Leong Gan, Uda Hashim

Microelectron. Reliab., 2015

2014

Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online).

Chong Leong Gan, Classe Francis, Bak Lee Chan, Uda Hashim

Microelectron. Reliab., 2014