Chisato Nagai

According to our database, Chisato Nagai authored at least 3 papers between 2014 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2015

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers.

K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.

Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.

K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014